![Semiconductor heat dissipation substrate for the purpose of heat release and absorption [heat sink]](https://image.mono.ipros.com/public/product/image/403/2000449777/IPROS59561808384274111961.jpeg?w=280&h=280)
Semiconductor heat dissipation substrate for the purpose of heat release and absorption [heat sink]
The coil material for the heat sink can be continuously processed up to a thickness of 5mm by adopting a progressive die! This contributes to lower costs and shorter delivery times. Please feel free to consult with us.
Our company handles heat sinks (base plates). Thanks to precision progressive dies, the dimensional accuracy of the outer shape and hole pitch has greatly improved, resulting in significantly enhanced finish quality on both the edge and shear surfaces. The coil material can be continuously processed up to a thickness of 5mm due to the adoption of progressive dies, contributing to lower costs and shorter delivery times. We utilize UV printing. In addition to micron-level flatness and specified warp processing, we also support resist baked printing. 【Features】 ■ High dimensional accuracy of the outer shape and hole pitch due to precision progressive dies ■ Continuous processing of coil material up to a thickness of 5mm through the use of progressive dies ■ Adoption of UV printing ■ Capability for micron-level flatness and specified warp processing ■ Support for resist baked printing *For more details, please refer to the PDF document or feel free to contact us.
- Company：三昌製作所
- Price：Other
